Manufacturing Engineering Technician
: Job Details :

Shift 2nd shift (4 PM To 12 PM) b. Hands on processing experience in semiconductor-like processing steps. c. Must have good dexterity and be able to handle small sensitive parts. d. Must be capable of learning to operate new tools and learning new chemical processing steps. e. Must be observant and based on technical knowledge, identify sources of variability and/or yield impact. f. Must be very flexible to learn new tasks as the workload is variedg. Process wafers and/or other substrates through plating, lithography (coat, expose, develop), wet and dry etch, clean, thin film vacuum deposition, packaging, etc. h. Identify, communicate, and solve problems, organize projects and workflow. i. Accurately document and summarize data and process steps, as specified. j. Work closely with Engineers, Scientists, and Inventors from many different disciplines. Must be able to work independently as well as be a good team player. K. Have a working knowledge of Microsoft Office.