Integration Engineer
: Job Details :


Integration Engineer

GLOBALFOUNDRIES

Location: Malta,NY, USA

Date: 2024-05-04T01:28:01Z

Job Description:

Skillset: Process Integration Engineer RF

Client: GlobalFoundries

Location: Malta, New York 12020

Duration: Direct Hire

Salary Range

Level 5: Senior Engineer - $90k $104k 3+ years and Bachelor s or above

Level 6: Principle Integration Engineer - $112k 124k 4+ years and Masters or above

Level 7: MTS (Member Technical Staff) Integration Engineer - $132,800 - $148k 7+ years and Masters or above

Level 8: SMTS (Senior Member Technical Staff) Integration Engineer - $150k - $168k 8+ years and Masters of above

  • Visa: Can take any work authorization except for E2 visas due to the educational requirements
  • can offer relocation allowance of $12 - $15k
  • 10% annual performance bonus (50/50 individual and company performance)
  • LTIs/RSU grants negotiated for L6 and above

Basic Qualifications:

  • Master's Degree - must be in Electrical Engineering, Materials Science, Solid State Physics, or other relevant engineering physical science discipline
  • 8+ years of working experience in Semiconductor industry
  • 5+ years of Process/Product Integration Engineer experience
  • Lead Engineer experience - developing and delivering advanced technology for mass production
  • 6 months+ experience with RF Technologies

Role Overview:

Seeking an experienced professional to support the 300mm semiconductor process integration team. The core responsibilities of this team involve ownership of process integration from development, customer engagement to production. The ideal candidate should have a proven track record of developing and delivering advanced technology for mass production. Also, the ideal candidate can demonstrate a technical understanding of various processes and an understanding of a balanced scorecard approach to develop, sustain, and improve the technologies with quality, cost, and delivery all considered. Feature rich process development in various technologies including FINFET technologies, FDSOI, eNVM, HV, Photonics and RF. Collaborating with process module & packaging team in driving process solutions. Working with Technology Development & Business Unit to oversee the scope of projects and ensure that all technical needs are catered to.

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